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Wafers 22
| | Contract Manufacturing - Electronics and Electrical, Business 1,013
 ACI GroupACI Group
 Offers turnkey contract manufacturing, logistics and testing services.
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Advanced Thin Film TechnologiesAdvanced Thin Film Technologies
 Supplying custom coatings and patterned substrates to customers involved with microelectronics with information on coatings, patterning, capabilities, manufacturing and contacts.
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Advanced Thin Film TechnologyAdvanced Thin Film Technology
 Provides high quality thin film coatings, patterned substrates, hybrid and resistor networks.
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Allied CoatingsAllied Coatings
 Custom thin film deposition and thin film device fabrication.
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AME ASAME AS
 Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.
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AmitecAmitec
 Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.
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Ampac Enterprises, Inc.Ampac Enterprises, Inc.
 Offering assembly services for plastic IC packaging and full box build contract manufacturing.
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ASE Korea, Inc.ASE Korea, Inc.
 Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF.
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Catalyst Microtech LLCCatalyst Microtech LLC
 Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages. List of services and factory equipment and quotation form.
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Chartered Semiconductor ManufacturingChartered Semiconductor Manufacturing
 Dedicated integrated circuit (IC) wafer foundry
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Cirtek Electronics CorporationCirtek Electronics Corporation
 An independent subcontractor for semiconductor assembly, test and packaging services.
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DALSA SemiconductorDALSA Semiconductor
 Open foundry offering specialty wafer fabrication for MEMS, high voltage CMOS, analog and mixed signal CMOS, and CCDs with experience in telecom, telephony, and optical networking chips. Company overview, facilities and manufacturing process descriptions.
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Dolphin Technology Inc.Dolphin Technology Inc.
 Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks.
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Eltek Semiconductors LtdEltek Semiconductors Ltd
 Procuring and processing semiconductor components in wafer, die and packaged form.
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First Level Inc.First Level Inc.
 Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
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Honeywell Electronic MaterialsHoneywell Electronic Materials
 Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Site includes product and technology briefs, and a description of company's manufacturing cleanroom.
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HTE LabsHTE Labs
 Provides wafer foundry, R&D support and specialty wafer fab processing to customers from semiconductors and microelectronic industry; active and passive components, and opto devices. Semconix Corporation.
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IncideIncide
 A fabless design house focused on RF and high-speed digital integrated designs.
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Jade Precision Engineering Pte LtdJade Precision Engineering Pte Ltd
 Singapore-based company providing lead-frame stamping, milling, plating, and taping services for semiconductors. Company history, description of services, and photos of example products.
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MEMT Co.MEMT Co.
 A 6" discrete wafer foundry, specializing in Schottky, SF, TVS and Thyristor wafer.
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NILY technologiesNILY technologies
 Fabless company aiming to lead the RF GaAs and silicon IC intellectual properties. Leveraging advanced design capabilities, simulation, layout tools to shorten specific RF circuit and system needs.
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NOVASICNOVASIC
 Providing wafering and polishing services of high performance semiconductors and industrial crystals.
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NS ElectronicsNS Electronics
 IC packaging and test turnkey solutions with excellent quality, cycle time and pricing.
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PolarFabPolarFab
 Bipolar and BiCMOS wafer manufacturing processes. Bloomington, MN, USA.
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Prema SemiconductorPrema Semiconductor
 Fabricates analog and mixed-signal ICs
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Premier Semiconductor ServicesPremier Semiconductor Services
 Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.
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Prologue Technology Inc.Prologue Technology Inc.
 Manufacturer representative for semiconductor design and manufacturing. Based in Markham, Ontario, Canada, serving primarily Canada, Central and Eastern US. Close proximity to the Lester B. Pearson Airport in Toronto.
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Promex Industries Inc.Promex Industries Inc.
 Microelectronics technologies, specialty chip packaging, design, layout, materials expertise, process engineering for outsourced optoelectronics, microelectronics, chip packaging and manufacturing. From China.
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Protochips Inc.Protochips Inc.
 Offers custom layout and fabrication services for emerging companies and university groups.
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Reltech LimitedReltech Limited
 European supplier of advanced semiconductor burn-in and reliability test systems.
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Satcon ElectronicsSatcon Electronics
 Manufacturer standard and custom microelectronic assemblies, thin film substrates, semiconductor packaging and wire bonding. Company overview and list of capabilities.
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Sigurd Microelectronics CorporationSigurd Microelectronics Corporation
 Provides semiconductor IC assembly and testing services.
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Silicon Infusion LimitedSilicon Infusion Limited
 Provides single chip solutions for T1/E1/J1, DTMF, ADPCM, and many other telecommunications standards.
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Silterra Malaysia Sdn BhdSilterra Malaysia Sdn Bhd
 Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia.
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1st Silicon1st Silicon
 Semiconductor foundry founded in 1998 by the Malaysian State of Sarawak. 0.18 and 0.25 micron CMOS and mixed signal CMOS IC.
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Tower Semiconductor LTD.Tower Semiconductor LTD.
 Independent foundry of semiconductor integrated circuits specializing in embedded nonvolatile memory, CMOS image sensors, and mixed signal devices. 0.35 micron and up. Israel.
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Trikon TechnologiesTrikon Technologies
 Semiconductor manufacturer utilizing plasma etch, PVD (physical vapour deposition) and CVD (chemical vapour deposition) equipment.
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ValtronicValtronic
 Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Site include capabilites, and illustrated discussions of packaging technologies and processes.
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ViASICViASIC
 Company offering low NRE one mask architecture and software solutions to the ASIC community. Aimed at FPGA conversion and ASIC replacement markets.
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WaferTechWaferTech
 Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.
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Walls Technology Co.Walls Technology Co.
 Custom RF and microwave (wireless) product development. Requirements definition, analysis, design, prototype build and test.
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